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TSMC plans another $100B in Phoenix chip facilities

The expansion would add four more advanced semiconductor manufacturing and packaging sites, bringing TSMC’s U.S. commitment to $265B.

Reported · Written up by our desk · Industry

Taiwan Semiconductor Manufacturing Co. will invest an additional $100B in U.S. chipmaking facilities in Phoenix, raising its total American investment commitment to $265B, according to a U.S. Department of Commerce release cited by Bisnow.

The added investment is expected to support four more advanced semiconductor manufacturing facilities, increasing TSMC’s total to 12 leading-edge semiconductor and packaging facilities in the region.

In a statement, TSMC Chairman and CEO C.C. Wei said the move is intended to meet multi year demand from major U.S. customers, strengthen the supply chain, and support significant job creation.

Bisnow also notes that TSMC’s U.S. investment began in 2024 with a $65B commitment under the CHIPS Act, including a $6.6B federal grant, and that developers and industrial activity around Phoenix have intensified as domestic microchip demand has surged.

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