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Intel’s EMIB boosts chip packaging competition with TSMC
TSMC is developing an “EMIB-like” packaging approach, while Intel shares jumped about 11% on July 30 after the report.
TSMC is reportedly building a new chip packaging technology modeled on Intel’s EMIB, according to a Yahoo Finance write-up citing The Information. The project is said to be internally referred to as “EMIB-like” and is being developed with Taiwanese substrate supplier Kinsus Interconnect Technology.
The competitive race is centered on how chips are packaged. Yahoo Finance notes that TSMC’s main approach, CoWoS, relies on a large and expensive silicon layer, while Intel’s EMIB uses smaller silicon bridges only where chips connect, a design that could fit the growing scale of AI chip layouts.
Following the report, TSMC’s U.S.-listed shares rose about 8% and Intel climbed roughly 11% on July 30, signaling investor attention on packaging as a potential differentiator. The story also points out that TSMC’s CoWoS is sold out into 2027, with some customers waiting well over a year, which can push buyers to seek alternative suppliers.
For Intel, packaging represents an opening even as its broader foundry turnaround has lagged. Yahoo Finance says Intel’s external foundry revenue was $293 million last quarter, compared with $5.8 billion total foundry revenue, and it adds that Intel’s newest EMIB-T reached a 98% yield rate and has drawn interest from Google, Amazon, and Nvidia. Meanwhile, TSMC appears to be addressing the risk by pursuing the Kinsus-linked “EMIB-like” effort.