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Chinese chip fabs push equipment localisation targets
At a new fab in Wuxi, one large customer is aiming for 80.0% localisation of production equipment, raising the bar for domestic toolmakers to deliver consistent, high-volume performance.
Chinese chipmakers are setting more aggressive localisation targets for semiconductor production equipment, a shift that is putting pressure on domestic toolmakers to prove their systems can operate reliably at high-volume wafer fabs, according to SCMP Economy.
Jie Chen, chairman of Britech Semiconductor Equipment (Shanghai) Corp, said at an industry conference in Wuxi that one large customer at a new fab is aiming for 80.0% localisation of equipment.
Industry leaders caution that the equipment sector must move beyond proving technical feasibility to achieving commercial reliability, including consistent performance across multiple chambers and machines.
Chen described the challenge as a transition from an early development phase to a broader “2.0 era,” adding that the sector’s “final exam” would be winning top overseas clients without the home-turf advantage.