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Huawei unveils 7.2Tbps optical module aimed at AI data center bottlenecks
The near-packaged optics design moves optical components closer to switching chips to cut power use and signal loss as AI clusters scale.
Huawei Technologies has unveiled a high-speed near-packaged optics optical module aimed at reducing bottlenecks in AI data center infrastructure, positioning the company for next-generation standards for faster, more efficient connections between processors.
Huawei showed what it described as an industry first 7.2-terabit-per-second near-packaged optics product at the China International Optoelectronic Exposition in Shenzhen this week. The design replaces copper links with light-based signals to improve bandwidth, transmission distance, and power efficiency compared with current systems.
According to Huawei’s advanced optoelectronics laboratory director Man Jiangwei, the module combines 36 channels running at 200 gigabits per second each, for an aggregate bandwidth of 7.2Tbps.
Huawei said it has already entered product development and expects that, once the supply chain and manufacturing system are in place, it could move into volume production soon, the South China Morning Post reported. The article also notes Broadcom has developed 6.4Tbps optical engines for co-packaged optics as other high-density optical interconnect options emerge for AI systems.
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