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TSMC and Samsung will use ASML High NA EUV for advanced chips
CNBC World reports the move is tied to demand for smaller, more complex semiconductors driven by AI workloads.
TSMC and Samsung have committed to adopting ASML’s newest High NA EUV tools for advanced chipmaking, as demand rises for more capable semiconductor hardware. According to CNBC World, the High NA approach is aimed at producing smaller and more complex chips, a fit for the needs of AI-driven computing.
The companies’ decision highlights how AI demand is shaping the next generation of semiconductor equipment purchases across major Asian manufacturers.