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Mold-Tek Technologies stock rises after board approves 1:1 bonus issue
The bonus issue record date is Oct. 9, and paid-up equity capital is set to nearly double to ₹11,52,20,472.
Mold-Tek Technologies shares rose nearly 3% after the engineering services company announced a 1:1 bonus equity share issue.
The company said the board approved issuing one bonus share for every one existing fully paid-up equity share held by eligible shareholders on the record date, which is set for October 9, with investors needing to own shares by October 8.
Mold-Tek reported authorised equity share capital of ₹13,00,00,000 and existing paid-up equity share capital of ₹5,76,10,236, and said the paid-up equity share capital would increase to ₹11,52,20,472 after the proposed bonus issuance.
Over the past three months, the stock gained 53%, and it was trading around ₹206.50 at the time of the update, according to LiveMint Markets.