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TSMC developing EMIB-like chip packaging in bid to challenge Intel
The reported effort includes work with Kinsus Interconnect Technology, and Nvidia is said to be evaluating Intel’s EMIB for a future processor.
Taiwan Semiconductor Manufacturing Co. is reportedly developing an advanced chip packaging technology aimed at eroding Intel Corp.’s competitive advantage, according to The Information cited by Yahoo Finance and Benzinga. The new approach is described as similar to Intel’s Embedded Multi-die Interconnect Bridge, or EMIB, which uses silicon bridges to connect multiple chip components and support larger, more complex processors with improved efficiency and lower manufacturing costs.
The report says TSMC is working with Taiwan’s Kinsus Interconnect Technology on the project, internally dubbed “EMIB Like.” Yahoo Finance and Benzinga also note that Nvidia Corp. is evaluating Intel’s EMIB packaging technology for a future processor.
TSMC currently relies on its advanced CoWoS (Chip-on-Wafer-on-Substrate) packaging technology for AI chips supplied to major customers, including Nvidia and Advanced Micro Devices. In April, TSMC announced plans to expand CoWoS with a 14-reticle package scheduled for production in 2028, designed to integrate about 10 large compute dies and 20 HBM stacks.
The report arrives after Intel announced a strategic partnership with China’s Lens Technology to develop glass substrate-based advanced semiconductor packaging for future AI and data center chips. Yahoo Finance and Benzinga said TSMC, Intel, and Nvidia did not immediately respond to requests for comment.