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Huawei’s top chip scientist describes execution as key to fast AI chips
Huawei says its HiSilicon chip team taped out dozens of new designs annually with a hit rate that helped avoid mass production failures, according to an interview featured by SCMP Economy.
Huawei’s chief scientist in its semiconductor business, Liao Heng, said he initially doubted China’s ability to build world-class chips when he joined the chip-design unit in 2016, after spending more than a decade in the United States observing what he described as a long sunset for American chip start-ups.
In a business podcast interview that SCMP Economy highlighted, Liao attributed his change in view to seeing Huawei’s execution first hand, saying Huawei’s HiSilicon unit finalized, or taped out, dozens of new chip designs each year without any failures reaching mass production.
Liao, who is also described as the chief architect behind Huawei’s Ascend AI processors, framed the approach as relying on highly qualified teams and on bringing Silicon Valley expertise back to China while navigating US sanctions and leveraging domestic strengths to build self-reliant AI computing infrastructure.
The interview was hosted last month by a reporter from a mainland news organization, and it positions Liao at the center of China’s push for technological self-reliance in semiconductors and AI infrastructure.