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Biren unveils optical supernode systems to link thousands of AI chips
The Shanghai-based company says its distributed supernode design could scale to 1,024 AI cards in a single cluster while using near-packaged optics to boost data speeds.
Chinese semiconductor design firm Biren Technology has unveiled next-generation “supernode” systems aimed at linking thousands of AI chips within a single cluster using optical data transmission to reduce current hardware bottlenecks, according to SCMP Economy.
Biren is pursuing a distributed, decoupled supernode architecture and near-packaged optics that moves optical fibers closer to chips, a strategy intended to raise data speeds as AI model sizes expand and demand grows for larger, more connected server platforms.
The company says the approach could allow a cluster to scale up to 1,024 cards.
SCMP Economy noted the launch highlights how AI infrastructure providers are competing to address limits in how chips communicate as the industry races to expand raw computing power.