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China chip-tool maker links wafer metrology into polishing workflow

Hwatsing Technology said its new measurement tool can be integrated into the chemical mechanical polishing process for real time readings before and after polishing.

Reported · Written up by our desk · China

Chinese chip-tool developers are making technical progress in wafer manufacturing, with Hwatsing Technology highlighting a breakthrough aimed at chemical mechanical polishing, a step that flattens and smooths silicon discs used as the base for microchips.

According to the company, its new measurement tool can be integrated directly into the polishing workflow, enabling real time measurements before and after polishing and feeding live data back to the control system.

Hwatsing said the setup could improve wafer uniformity and reduce waste, addressing inefficiencies tied to traditional production lines.

Based in Tianjin, the firm reported that it has shipped the system to an unnamed leading domestic optical silicon materials producer.

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