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Chinese team says it cut production time for 3D optical chips
The method aims to speed up fabrication of complex 3D optical structures, helping scale next-generation 3D integrated photonics tied to AI demand.
Artificial intelligence demand is pushing companies to pursue faster next-generation computing hardware, and photonic chips have become a focus because they transmit data with light rather than electricity, which could help address bandwidth and power limits, according to SCMP Economy.
The outlet reports that a Chinese research team says it overcame a key manufacturing bottleneck for complex three-dimensional optical structures by using a new fabrication method that cuts production time from hours to seconds.
SCMP Economy says the work targets scalability challenges that have slowed the transition from photonics concepts to mass-producible hardware, framing the advance as a step toward bridging design complexity and scalable manufacturing.
The research team, led by PhD student Wang Yi, described the approach as a versatile platform for next-generation 3D integrated photonics, with the study presented in Beijing on July 19, 2026.