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AMD to invest over $10 billion in Taiwan for advanced chip packaging
The program is expected to run through 2029 as AMD adds capacity across advanced packaging, chip substrates, and manufacturing for AI systems.
Advanced Micro Devices plans to invest more than $10 billion in Taiwan to expand advanced chip packaging and related ecosystem capacity, according to coverage by The Motley Fool via Yahoo Finance.
The spending is expected to continue through 2029 and is intended to support AMD's scaling of next generation AI products, with involvement across advanced packaging, chip substrates, and production capacity for complete AI systems.
AMD's roadmap includes ramping its Venice EPYC server CPU using TSMC's advanced 2 nanometer process, along with use of TSMC advanced packaging technologies for some AI and data center chips.
The company is also developing additional packaging efforts with suppliers such as ASE Technology and Siliconware Precision Industries, completing testing of a panel based version with Powertech Technology, and working with Taiwanese substrate partners tied to high volume Helios AI system production. The article notes that data center revenue rose 107.0% year over year to $6.7 billion in the second quarter, representing about 58% of AMD total revenue, and that tight advanced packaging capacity has been cited as a growth constraint for customers.