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Biwin Storage to invest 4.5 billion yuan in advanced packaging
The project is expected to push monthly wafer capacity to 10,000 by the end of 2027, after earlier phases generated no mass production revenue.
Chinese storage maker Biwin Storage Technology is investing 4.5 billion yuan (US$672 million) into a new phase of an advanced packaging and testing project in Dongguan, Guangdong province, according to SCMP Economy.
The funding, earmarked for the third phase, will be larger than the 3.09 billion yuan the company spent on the first two phases combined. SCMP Economy reports those earlier phases had not yet produced mass production revenue, as the facility was still in customer sampling, process verification, and small-batch production.
Biwin also estimated that the facility’s monthly capacity would more than triple to 10,000 wafers by the end of 2027, as stated in its filings and discussed in earlier investor meetings, SCMP Economy said.
The move reflects Biwin’s shift toward more sophisticated wafer-level technologies, building on its existing traditional memory and system-in-package operations in Huizhou, where it sources chips from external suppliers.